一、Core Advantage

      ★ Double groove and roomy glass protection technics,high protection ability;

      ★ Sipos、Glass、LTO three protection level,increasing the ability in high voltage&temperature;

      ★ Low stress&graded junction ,increasing avalanche&IR ability.

二、Chip Dimensions

                    Front View                   Sectional View1:≤200mil               Sectional View2:＞200mil

三、Specification

      1. SGPP Series     2. RGPP Series