一、Core Advantage

      ★ Advanced Photo Glass technics,high reliability;

      ★ Glass、Sipos、LTO three protection level,increasing the ability inVC& assembling process;

      ★ Advanced TVS diffusion technics, the IR could be controlled below 50UA for the wafer with 10v & 600w.

二、Chip Dimensions

       Front View1:             Front View2: 220mil       Sectional View(uni-directional)       Sectional View(bi-directional)      

三、Specification